[{"name":"Engineering and Application","count":1279,"id":1},{"name":"工程与应用","count":794,"id":2},{"name":"工程应用","count":602,"id":3},{"name":"综述","count":390,"id":4},{"name":"Reviews","count":292,"id":5},{"name":"基础理论","count":267,"id":6},{"name":"Basic Theory","count":191,"id":7},{"name":"Technical Review","count":67,"id":8},{"name":"Basic Theories","count":55,"id":9},{"name":"综合评论","count":53,"id":10},{"name":"学术平台","count":39,"id":11},{"name":"\"信息网络及对抗\"专题","count":16,"id":12},{"name":"The Special Column of Information Network and Conf","count":16,"id":13},{"name":"Computer Network","count":15,"id":14},{"name":"Algorithms and Intelligence","count":14,"id":15},{"name":"电子信息领域发展综述","count":14,"id":16},{"name":"算法与智能","count":14,"id":17},{"name":"超级链接","count":14,"id":18},{"name":"\"新概念武器\"专题","count":12,"id":19},{"name":"Space-Ground Integrated Information Network","count":12,"id":20},{"name":"The Special Column of New Concept Weapons","count":12,"id":21},{"name":"网络通信专题","count":12,"id":22},{"name":"\"元器件\"专题","count":11,"id":23},{"name":"Overview of electronic information","count":11,"id":24},{"name":"Review","count":11,"id":25},{"name":"The Special Column of the Components","count":11,"id":26},{"name":"雷达技术专题","count":11,"id":27},{"name":"\"ICT\"专题","count":10,"id":28},{"name":"\"信息和网络安全\"专题","count":10,"id":29},{"name":"\"射频综合\"专题","count":10,"id":30},{"name":"\"电磁信息控制\"专题","count":10,"id":31},{"name":"Cyberspace and Information","count":10,"id":32},{"name":"The Special Column of ICT","count":10,"id":33},{"name":"The Special Column of Information Perception","count":10,"id":34},{"name":"The Special Column of Information and Network Secu","count":10,"id":35},{"name":"The Special Column of RF Integration","count":10,"id":36},{"name":"The Speical Column of Electromagnetic Information ","count":10,"id":37},{"name":"“信息感知”专题","count":10,"id":38},{"name":"网信","count":10,"id":39},{"name":"\"SOA\"专题","count":9,"id":40},{"name":"\"天地一体化信息网络\"专题","count":9,"id":41},{"name":"\"微系统技术\"专题","count":9,"id":42},{"name":"\"系统集成\"专题","count":9,"id":43},{"name":"Reviews and Exploration","count":9,"id":44},{"name":"The Column of System Integration","count":9,"id":45},{"name":"The Special Column of Micro-System Technology","count":9,"id":46},{"name":"The Special Column of SOA","count":9,"id":47},{"name":"其他","count":9,"id":48},{"name":"综述·探索","count":9,"id":49},{"name":"计算机网络专题","count":9,"id":50},{"name":"雷达专题","count":9,"id":51},{"name":"\"赛博空间技术\"专题","count":8,"id":52},{"name":"Explorations and Applications","count":8,"id":53},{"name":"Internetwork Communication","count":8,"id":54},{"name":"The Special Column of Cyberspace Technology","count":8,"id":55},{"name":"探索与应用","count":8,"id":56},{"name":"\"THz\"研究专题","count":7,"id":57},{"name":"\"可靠性分析与评估技术\"专题","count":7,"id":58},{"name":"Communication Algorithm","count":7,"id":59},{"name":"Electronic Warfare","count":7,"id":60},{"name":"Intelligence and Algorithms","count":7,"id":61},{"name":"Radar Technology","count":7,"id":62},{"name":"The Special Column of AEW Technology","count":7,"id":63},{"name":"The Special Column of Research Basic Electronic Te","count":7,"id":64},{"name":"The Special Column of Research of on New Generatio","count":7,"id":65},{"name":"The Special Column of THz","count":7,"id":66},{"name":"The Special Column of Technology of Reliability An","count":7,"id":67},{"name":"“新一代信息技术应用研究”专题","count":7,"id":68},{"name":"“电子基础技术研究”专题","count":7,"id":69},{"name":"“预警机新技术”专题","count":7,"id":70},{"name":"智能与算法","count":7,"id":71},{"name":"电子对抗专题","count":7,"id":72},{"name":"通信·算法","count":7,"id":73},{"name":"\"微系统集成与应用\"专题","count":6,"id":74},{"name":"\"电子对抗\"专题","count":6,"id":75},{"name":"Communication and Network","count":6,"id":76},{"name":"Computer Applications","count":6,"id":77},{"name":"Cyberspace and Information Technology","count":6,"id":78},{"name":"Space Network Technology","count":6,"id":79},{"name":"Special Column of Research on Cognitive Technology","count":6,"id":80},{"name":"The Special Column of Advanced Manufacturing Techn","count":6,"id":81},{"name":"The Special Column of Micro-System Integration and","count":6,"id":82},{"name":"The Special Column of Research on Next Generation ","count":6,"id":83},{"name":"The Special Column of Simulation of Electronic Inf","count":6,"id":84},{"name":"The Speical Column of Electromagnetic War","count":6,"id":85},{"name":"“体系工程”专题","count":6,"id":86},{"name":"“信息汇聚技术”专题","count":6,"id":87},{"name":"“先进制造技术”专题","count":6,"id":88},{"name":"“新一代信息系统技术”专题","count":6,"id":89},{"name":"“电子信息系统及装备的仿真”专题","count":6,"id":90},{"name":"“认知技术应用研究”专题","count":6,"id":91},{"name":"空间网络技术专题","count":6,"id":92},{"name":"网信专题","count":6,"id":93},{"name":"计算机应用","count":6,"id":94},{"name":"计算机网络","count":6,"id":95},{"name":"通信与网络","count":6,"id":96},{"name":"\"军事电子信息技术体系\"专题","count":5,"id":97},{"name":"Electrical & Communications","count":5,"id":98},{"name":"Electronic Equipment System","count":5,"id":99},{"name":"Information Processing Technology","count":5,"id":100},{"name":"Microsystem and Hybrid Microcircuit Assembly Technology","count":5,"id":101},{"name":"Network Information Technology","count":5,"id":102},{"name":"Radar","count":5,"id":103},{"name":"Radars·Signal Processing","count":5,"id":104},{"name":"Space network security","count":5,"id":105},{"name":"Target Detection","count":5,"id":106},{"name":"The Special Column of Big Data","count":5,"id":107},{"name":"The Special Column of Optical Transmission","count":5,"id":108},{"name":"The Special Column of Reseanh in the area of Front","count":5,"id":109},{"name":"The Special Column of Research on Unmanned Electro","count":5,"id":110},{"name":"The Special Column of the System of Military Elect","count":5,"id":111},{"name":"“信息网络技术”专题","count":5,"id":112},{"name":"“光传输技术”专题","count":5,"id":113},{"name":"“前沿技术探索领域研究”专题","count":5,"id":114},{"name":"“大数据”专题","count":5,"id":115},{"name":"“天人电子信息系统及装备研究”专题","count":5,"id":116},{"name":"“智能天线技术”专题","count":5,"id":117},{"name":"“智能移动终端”专题","count":5,"id":118},{"name":"“纳米电子技术”专题","count":5,"id":119},{"name":"“量子信息技术”专题","count":5,"id":120},{"name":"“高效能计算”专题","count":5,"id":121},{"name":"专家论坛","count":5,"id":122},{"name":"微系统与混合集成电路微组装技术","count":5,"id":123},{"name":"电子装备系统","count":5,"id":124},{"name":"目标检测","count":5,"id":125},{"name":"空间网络安全专题","count":5,"id":126},{"name":"网络信息专题","count":5,"id":127},{"name":"计算机信息处理专题","count":5,"id":128},{"name":"通信专题","count":5,"id":129},{"name":"雷达·信号处理","count":5,"id":130},{"name":"Academic Papers","count":4,"id":131},{"name":"Cyberspace and Internet","count":4,"id":132},{"name":"Intelligent Unmanned","count":4,"id":133},{"name":"Network and Communication","count":4,"id":134},{"name":"RADAR","count":4,"id":135},{"name":"The Technology of Radar","count":4,"id":136},{"name":"Unmanned System","count":4,"id":137},{"name":"“致密能源”专题","count":4,"id":138},{"name":"学术论文","count":4,"id":139},{"name":"无人系统","count":4,"id":140},{"name":"智能无人","count":4,"id":141},{"name":"网络专题","count":4,"id":142},{"name":"Overview of Electronic Information","count":3,"id":143},{"name":"书讯","count":3,"id":144},{"name":"Expert Forum","count":2,"id":145},{"name":"Frontier Exploration","count":2,"id":146},{"name":"前沿探索","count":2,"id":147},{"name":"理论基础","count":2,"id":148},{"name":"行业动态","count":2,"id":149},{"name":"译文之窗","count":2,"id":150},{"name":"Specialist Forum","count":1,"id":151},{"name":"产品介绍","count":1,"id":152},{"name":"会议信息","count":1,"id":153},{"name":"信息交流","count":1,"id":154},{"name":"图书信息","count":1,"id":155},{"name":"译文选编","count":1,"id":156}]