[{"name":"电路与系统设计","count":1649,"id":1},{"name":"Circuit and System Design","count":1611,"id":2},{"name":"研究论文","count":724,"id":3},{"name":"技术报告","count":592,"id":4},{"name":"半导体器件与工艺","count":427,"id":5},{"name":"Semiconductor Device and Technology","count":417,"id":6},{"name":"Research Papers","count":255,"id":7},{"name":"Technical Reports","count":213,"id":8},{"name":"模型与算法","count":148,"id":9},{"name":"Features and Review","count":143,"id":10},{"name":"Product and Reliability","count":122,"id":11},{"name":"综合评述","count":118,"id":12},{"name":"产品与可靠性","count":115,"id":13},{"name":"动态综述","count":108,"id":14},{"name":"Technical Papers","count":92,"id":15},{"name":"Modeling and Algorithms","count":87,"id":16},{"name":"测试与封装","count":65,"id":17},{"name":"Testing and Packaging","count":63,"id":18},{"name":"Modeling and Algorithm","count":52,"id":19},{"name":"动态与综述","count":36,"id":20},{"name":"Features and Reviews","count":32,"id":21},{"name":"Invited Reports","count":28,"id":22},{"name":"特邀报告","count":28,"id":23},{"name":"产品与应用","count":27,"id":24},{"name":"DC-DC电源技术专题","count":22,"id":25},{"name":"Special Subject on DC-DC Power Supply Technologies","count":22,"id":26},{"name":"SiGe技术专题","count":20,"id":27},{"name":"Special Topic on SiGe Technology","count":20,"id":28},{"name":"电器与系统设计","count":18,"id":29},{"name":"电路与设计","count":17,"id":30},{"name":"研究报告","count":17,"id":31},{"name":"A/D Converter and D/A Converter Technology Special Reports","count":15,"id":32},{"name":"A/D转换器和D/A转换器技术专题报告","count":15,"id":33},{"name":"Cireuit and System Design","count":14,"id":34},{"name":"\"电子器件辐射效应与加固技术\"专题","count":11,"id":35},{"name":"Special Issue on The Radiation Effects and Hardening Techniques of Electronic Devices","count":11,"id":36},{"name":"Semiconductor Device and Tchnology","count":10,"id":37},{"name":"器件与工艺","count":10,"id":38},{"name":"模拟IC技术发展论坛","count":10,"id":39},{"name":"A Special Topic on RF IC Technology","count":9,"id":40},{"name":"RF IC技术专题","count":9,"id":41},{"name":"Product Applications","count":8,"id":42},{"name":"产品可靠性","count":8,"id":43},{"name":"二十四所建所40周年纪念特稿","count":7,"id":44},{"name":"ASIC技术","count":4,"id":45},{"name":"产品应用","count":4,"id":46},{"name":"半导体器件与艺术","count":4,"id":47},{"name":"电子24所新产品简介","count":4,"id":48},{"name":"Expert's Forum","count":3,"id":49},{"name":"专家论坛","count":3,"id":50},{"name":"半导体器体与工艺","count":3,"id":51},{"name":"动态综合","count":2,"id":52},{"name":"综合证述","count":2,"id":53},{"name":"综述评述","count":2,"id":54},{"name":"Product Application","count":1,"id":55},{"name":"Testing and Packagin","count":1,"id":56},{"name":"测诗与封装","count":1,"id":57}]
